ProductsManufacturers
Events
Send an RFQBOM Tool

SMM6325H

Epson

SMM6325H Datasheet
Epson SMM6325H
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T28
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    16KX8
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    250
  • Number of Words Code
    32K
  • Memory Density (bits)
    131072
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    4.0E-5
  • Supply Current-Max (mA)
    0.08
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10

0 suppliers available to buy or to bid for SMM6325H

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
SMM6325H
Send an RFQ
SMM6325H