ProductsManufacturers
Events
Send an RFQBOM Tool

SMJ55161AGB-70

MICROSS COMPONENTS

MICROSS COMPONENTS SMJ55161AGB-70
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    S-PPGA-P68
  • Memory Width
    16
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    VIDEO DRAM
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Memory Organization
    256KX16
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    70
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.012
  • Supply Current-Max (mA)
    180
  • Package Equivalence Code
    PGA68,9X9
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

0 suppliers available to buy or to bid for SMJ55161AGB-70

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
SMJ55161AGB-70
Send an RFQ
SMJ55161AGB-70