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SM55161AHKC-80

MICROSS COMPONENTS

MICROSS COMPONENTS SM55161AHKC-80
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    S-XQFP-F64
  • Memory Width
    16
  • Package Code
    GQFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, GUARD RING Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory IC Type
    VIDEO DRAM
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    256KX16
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    80
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.012
  • Supply Current-Max (mA)
    160
  • Package Equivalence Code
    TPAK64,1.6SQ,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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SM55161AHKC-80
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SM55161AHKC-80