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SM55161AGB-75M

MICROSS COMPONENTS

SM55161AGB-75M Datasheet
MICROSS COMPONENTS SM55161AGB-75M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PPGA-P68
  • Memory Width
    16
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    VIDEO DRAM
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Memory Organization
    256KX16
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    75
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.055
  • Supply Current-Max (mA)
    170
  • Package Equivalence Code
    PGA68,9X9
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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SM55161AGB-75M
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SM55161AGB-75M