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SM32C6416TGLZA6EP

Texas Instruments Incorporated

Texas Instruments Incorporated SM32C6416TGLZA6EP
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • RAM (words)
    16384
  • JESD-30 Code
    S-PBGA-B532
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Address Bus Width
    23
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Number of Terminals
    532
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.25
  • Supply Voltage-Max (V)
    1.24
  • Supply Voltage-Min (V)
    1.16
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA532,26X26,32
  • Clock Frequency-Max (MHz)
    100
  • Internal Bus Architecture
    MULTIPLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    TS 16949

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