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SINFP-3216-8-A2-DM10

SILICON360

SILICON360 SINFP-3216-8-A2-DM10
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    1000
  • JESD-30 Code
    S-PBGA-B1521
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    NO
  • Integrated Cache
    YES
  • Address Bus Width
    0
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1521
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    1.545
  • Supply Voltage-Min (V)
    1.455
  • Supply Voltage-Nom (V)
    1.5
  • External Data Bus Width
    0
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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SINFP-3216-8-A2-DM10