SG564128FH8NZNG by Smart Modular Technologies, Inc. | Sourcengine

Smart Modular Technologies, Inc. SG564128FH8NZNG

Lifecycle status
Discontinued
RoHS
RoHS compliant
Description
DRAM Module, 512MX64, CMOS
Category
Semiconductors Memory ICs DRAMs DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
3.5 mm
Length
67.6 mm
Technology
CMOS
Access Mode
DUAL BANK PAGE BURST
JESD-30 Code
R-XZMA-N204
Memory Width
64
Organization
512MX64
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory Density
34359738368 bit
Memory IC Type
DRAM MODULE
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.6 mm
Number of Ports
1
Number of Words
536870912 words
Seated Height-Max
30 mm
Temperature Grade
OTHER
Terminal Position
ZIG-ZAG
Additional Feature
AUTO/SELF REFRESH
Number of Functions
1
Number of Terminals
204
Number of Words Code
512M
Package Body Material
UNSPECIFIED
Operating Temperature-Max
85 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED