SF-1206SP200-2
Bourns, Inc.
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFuse Chip Slow Blow Acting 2A 63V SMD Solder Pad 1206 Ceramic T/R
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.10.00.40
- SB Code8536.10.00.40
- Fuse Size1206
- J-STD-609 Codee3
- Packing MethodTR, 7 INCH
- Terminal ShapeWRAPAROUND
- Terminal FinishTIN OVER NICKEL
- Body Height (mm)0.6
- Mounting FeatureSURFACE MOUNT
- Body Breadth (mm)1.55
- Rated Current (A)2
- Blow CharacteristicTIME LAG
- Joule-integral-Nom (J)0.509
- Rated Voltage (DC) (V)63
- Circuit Protection TypeELECTRIC FUSE
- Rated Breaking Capacity (A)50
- Body Length or Diameter (mm)3.1
- Trip Time or Delay (Seconds)1
- Operating Temperature-Max (Cel)105
- Operating Temperature-Min (Cel)-20
- Screening Level / Reference StandardUL
0 suppliers available to buy or to bid for SF-1206SP200-2
Send an RFQ
Send an RFQ Your RFQ will be directly sent to our expert: Pari
Send an RFQ
SF-1206SP200-2
Send an RFQ
SF-1206SP200-2