SF-0603HI400F-2
Bourns, Inc.
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionFuse Chip 4A 35V SMD Solder Pad 0603 1.6 X 0.81 X 0.36mm T/R
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8536.10.00.40
- SB Code8536.10.00.40
- Fuse Size0603
- J-STD-609 Codee3
- Packing MethodTR, 7 INCH
- Terminal ShapeWRAPAROUND
- Terminal FinishTin (Sn) - with Nickel (Ni) barrier
- Body Height (mm)0.36
- Mounting FeatureSURFACE MOUNT
- Body Breadth (mm)0.81
- Rated Current (A)4
- Additional FeatureRATED BREAKING CAPACITY AT 24 VDC: 50 A
- Joule-integral-Nom (J)1.2
- Rated Voltage (AC) (V)35
- Rated Voltage (DC) (V)35
- Circuit Protection TypeELECTRIC FUSE
- Pre-arcing time-Min (ms)1
- Rated Breaking Capacity (A)35
- Body Length or Diameter (mm)1.6
- Trip Time or Delay (Seconds)0.0002
- Operating Temperature-Max (Cel)90
- Operating Temperature-Min (Cel)-55
- Screening Level / Reference StandardCUL; UL
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SF-0603HI400F-2