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SE370C777AJNT

Texas Instruments Incorporated

Texas Instruments Incorporated SE370C777AJNT
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.15
  • Bit Size
    8
  • CPU Family
    TMS370
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    60.96
  • Speed (MHz)
    5
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-CDIP-T64
  • PWM Channels
    YES
  • Package Code
    WSDIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, WINDOW, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of I/O Lines
    53
  • Number of Terminals
    64
  • Program Memory Type
    UVPROM
  • Terminal Pitch (mm)
    1.778
  • Data RAM Size (bytes)
    512
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    6.15
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    56
  • Package Equivalence Code
    SDIP64,.75
  • Clock Frequency-Max (MHz)
    20
  • Program Memory Size (words)
    24576
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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SE370C777AJNT