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SE370C756AFZL

Texas Instruments Incorporated

Texas Instruments Incorporated SE370C756AFZL
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.15
  • Format
    FIXED POINT
  • Bit Size
    8
  • Technology
    CMOS
  • Width (mm)
    23.94
  • Length (mm)
    23.94
  • RAM (words)
    512
  • Speed (MHz)
    5
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    S-CQCC-J68
  • PWM Channels
    YES
  • Package Code
    QCCJ
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Low Power Mode
    YES
  • Integrated Cache
    NO
  • Number of Timers
    2
  • Address Bus Width
    16
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    6 CHIP SELECT SIGNALS; MICROPROCESSOR MODE WITH/WITHOUT PROGRAM ROM; FOR SYSTEM EVALUATION
  • Number of I/O Lines
    55
  • Number of Terminals
    68
  • Program Memory Type
    UVPROM
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    2
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Number of DMA Channels
    0
  • On Chip Data RAM Width
    8
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    56
  • Clock Frequency-Max (MHz)
    20
  • Program Memory Size (words)
    16384
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Number of External Interrupts
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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SE370C756AFZL
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SE370C756AFZL