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SDIN7DP4-64G-Q

SANDISK CORP.

SANDISK CORP. SDIN7DP4-64G-Q
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Width
    11.5 mm
  • Length
    13 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    8
  • Organization
    64GX8
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    549755813888 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Words
    68719476736 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.4 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    153
  • Programming Voltage
    3.3 V
  • Number of Words Code
    64G
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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SDIN7DP4-64G-Q