SCB18T512160AF-3DX
XIAN UNILC SEMICONDUCTORS CO LTD
- Lifecycle statusContact Mfr
- DescriptionDDR2 DRAM, 32MX16, CMOS, PBGA84
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.28
- SB Code8542.32.00.15
- Width8 mm
- Length12.5 mm
- TechnologyCMOS
- Access ModeMULTI BANK PAGE BURST
- JESD-30 CodeR-PBGA-B84
- Memory Width16
- Organization32MX16
- Package CodeTFBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, THIN PROFILE, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density536870912 bit
- Memory IC TypeDDR2 DRAM
- Operating ModeSYNCHRONOUS
- Terminal Pitch0.8 mm
- Number of Ports1
- Number of Words33554432 words
- Seated Height-Max1.2 mm
- Temperature GradeMILITARY
- Terminal PositionBOTTOM
- Additional FeatureAUTO REFRESH
- Number of Functions1
- Number of Terminals84
- Number of Words Code32M
- Package Body MaterialPLASTIC/EPOXY
- Operating Temperature-Max125 Cel
- Operating Temperature-Min-55 Cel
- Supply Voltage-Max (Vsup)1.9 V
- Supply Voltage-Min (Vsup)1.7 V
- Supply Voltage-Nom (Vsup)1.8 V
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SCB18T512160AF-3DX