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S71WS512ND0BFIE32

SPANSION INC.

SPANSION INC. S71WS512ND0BFIE32
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    9
  • Length (mm)
    12
  • JESD-30 Code
    R-PBGA-B84
  • Memory Width
    16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    MEMORY CIRCUIT
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PSRAM IS ORGANIZED AS 8M X 16BIT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
  • Memory Organization
    32MX16
  • Number of Functions
    1
  • Number of Terminals
    84
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    33554432
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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S71WS512ND0BFIE32