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S3C7559XX-AT

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. S3C7559XX-AT
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • CPU Family
    SAM47
  • Technology
    CMOS
  • Width (mm)
    19.05
  • Length (mm)
    57.8
  • Speed (MHz)
    6
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PDIP-T64
  • PWM Channels
    NO
  • Package Code
    SDIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    ALSO OPERATES AT 1.8V MIN SUPPLY @3MHZ
  • Number of I/O Lines
    55
  • Number of Terminals
    64
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    1.778
  • Data RAM Size (bytes)
    512
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    8
  • Package Equivalence Code
    SDIP64,.75
  • Clock Frequency-Max (MHz)
    6
  • Program Memory Size (words)
    32768
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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S3C7559XX-AT