Samsung Semiconductor, Inc. S3C2400XX-YE
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Speed (MHz)
    133
  • JESD-30 Code
    S-PBGA-B208
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA208,16X16,25
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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