S29GL256M11FAIR22
Advanced Micro Devices, Inc. (AMD)
- Lifecycle statusTransferred
- DescriptionFlash, 16MX16, 110ns, PBGA64
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- TypeNOR TYPE
- Ready/BusyYES
- TechnologyCMOS
- Toggle BitYES
- Data PollingYES
- JESD-30 CodeS-PBGA-B64
- Memory Width16
- Package CodeBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee0
- Memory IC TypeFLASH
- Operating ModeASYNCHRONOUS
- Parallel/SerialPARALLEL
- Terminal FinishTin/Lead (Sn/Pb)
- DLA QualificationNot Qualified
- Page Size (words)4/8
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Memory Organization16MX16
- Number of Functions1
- Number of Terminals64
- Sector Size (words)64K
- Terminal Pitch (mm)1
- Access Time-Max (ns)110
- Number of Words Code16M
- Memory Density (bits)268435456
- Package Body MaterialPLASTIC/EPOXY
- Alternate Memory Width8
- Command User InterfaceYES
- Common Flash InterfaceYES
- Number of Sectors/Size512
- Output Characteristics3-STATE
- Number of Words (words)16777216
- Standby Current-Max (A)5.0E-6
- Supply Current-Max (mA)60
- Package Equivalence CodeBGA64,8X8,40
- Operating Temperature-Max (Cel)85
- Operating Temperature-Min (Cel)-40
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S29GL256M11FAIR22