ProductsManufacturers
Events
Send an RFQBOM Tool

S2017

APPLIED MICRO CIRCUITS CORP

APPLIED MICRO CIRCUITS CORP S2017
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-CBGA-B156
  • Package Code
    LBGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    NO
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    156
  • Terminal Pitch (mm)
    1.27
  • Output Data Bus Width
    16
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    1.65
  • External Data Bus Width
    16
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, CROSSBAR SWITCH

0 suppliers available to buy or to bid for S2017

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
S2017
Send an RFQ
S2017