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S1C33209F00E10P

Epson

Epson S1C33209F00E10P
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    16
  • Length (mm)
    16
  • Speed (MHz)
    60
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    YES
  • JESD-30 Code
    S-PQFP-G144
  • PWM Channels
    YES
  • Package Code
    TFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Address Bus Width
    25
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    74
  • Number of Terminals
    144
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    16
  • Clock Frequency-Max (MHz)
    48
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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S1C33209F00E10P