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RM7965A-900UI

Microsemi Corporation

RM7965A-900UI Datasheet
Microsemi Corporation RM7965A-900UI
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • Speed (MHz)
    900
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • Integrated Cache
    YES
  • Address Bus Width
    64
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES BETWEEN 3.15 TO 3.45 V FOR I/OS
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.77
  • External Data Bus Width
    64
  • Clock Frequency-Max (MHz)
    200
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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RM7965A-900UI
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RM7965A-900UI