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RM3315-XSNI-B

Dialog Semiconductor

Dialog Semiconductor RM3315-XSNI-B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    3.9 mm
  • Length
    4.925 mm
  • Endurance
    10000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    1
  • Organization
    128KX1
  • Package Code
    SOP
  • JESD-609 Code
    e4
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    131072 bit
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Ports
    1
  • Number of Words
    131072 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Seated Height-Max
    1.75 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Programming Voltage
    1.2 V
  • Standby Current-Max
    9.0E-5 Amp
  • Number of Words Code
    128K
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    SOP8,.25
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.23 V
  • Supply Voltage-Min (Vsup)
    1.17 V
  • Supply Voltage-Nom (Vsup)
    1.2 V
  • Clock Frequency-Max (fCLK)
    1 MHz

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RM3315-XSNI-B
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RM3315-XSNI-B