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RM3313-X-DWF

Adesto Technologies Corporation

Adesto Technologies Corporation RM3313-X-DWF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-XUUC-N
  • Memory Width
    1
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    UNSPECIFIED
  • Memory Organization
    32KX1
  • Number of Functions
    1
  • Number of Words Code
    32K
  • Memory Density (bits)
    32768
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    1.23
  • Supply Voltage-Min (V)
    1.17
  • Supply Voltage-Nom (V)
    1.2
  • Data Retention Time-Min
    10
  • Number of Words (words)
    32768
  • Programming Voltage (V)
    1.2
  • Standby Current-Max (A)
    9.0E-5
  • Package Equivalence Code
    DIE OR CHIP
  • Clock Frequency-Max (MHz)
    1
  • Endurance (Write/Erase Cycles)
    10000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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RM3313-X-DWF
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RM3313-X-DWF