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RM25C64C-LCSI-T

Adesto Technologies Corporation

Adesto Technologies Corporation RM25C64C-LCSI-T
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    1.28
  • Length (mm)
    1.47
  • JESD-30 Code
    R-PBGA-B6
  • Memory Width
    1
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    SEATED HGT-NOM
  • Memory Organization
    64KX1
  • Number of Functions
    1
  • Number of Terminals
    6
  • Terminal Pitch (mm)
    0.4
  • Number of Words Code
    64K
  • Memory Density (bits)
    65536
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.35
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    65536
  • Clock Frequency-Max (MHz)
    10
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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RM25C64C-LCSI-T
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RM25C64C-LCSI-T