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RM25C64C-BSNC-B

Dialog Semiconductor

Dialog Semiconductor RM25C64C-BSNC-B
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    3.9 mm
  • Length
    4.925 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    1
  • Organization
    64KX1
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    65536 bit
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Words
    65536 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Seated Height-Max
    1.75 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Number of Words Code
    64K
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Clock Frequency-Max (fCLK)
    5 MHz
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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RM25C64C-BSNC-B
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RM25C64C-BSNC-B