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RM24C256C-LCSI-T

Dialog Semiconductor

Dialog Semiconductor RM24C256C-LCSI-T
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B6
  • Memory Width
    1
  • Organization
    256KX1
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    262144 bit
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.4 mm
  • Number of Words
    262144 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • Seated Height-Max
    0.35 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    SEATED HGT-NOM
  • Number of Functions
    1
  • Number of Terminals
    6
  • Number of Words Code
    256K
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    1.65 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    1 MHz

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RM24C256C-LCSI-T
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RM24C256C-LCSI-T