ADVANCED INTERCONNECTIONS CORP RLS664-01GG3M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8536.69.40.40
  • SB Code
    8536.69.40.40
  • J-STD-609 Code
    e4
  • Contact Material
    BERYLLIUM COPPER/COPPER ALLOY
  • Housing Material
    POLYBUTYLENE TEREPHTHALATE
  • Device Socket Type
    IC SOCKET
  • Number of Contacts
    64
  • Device Type Used On
    DIP64
  • Contact Finish - Mating
    GOLD OVER NICKEL
  • Contact Finish - Termination
    Gold (Au) - with Nickel (Ni) barrier

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RLS664-01GG3M