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RD38F4060L0YBB0

Micron Technology

RD38F4060L0YBB0 Datasheet
Micron Technology RD38F4060L0YBB0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    R-PBGA-B103
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MEMORY CIRCUIT
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    70 ns
  • Mixed Memory Type
    FLASH+SDRAM
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    80 mA
  • Number of Terminals
    103
  • Standby Current-Max
    2.0E-5 Amp
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA103,9X12,32
  • Supply Voltage-Nom (Vsup)
    1.8 V

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RD38F4060L0YBB0