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RD38F2020W0YBQ0

Micron Technology

Micron Technology RD38F2020W0YBQ0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    HYBRID
  • JESD-30 Code
    R-PBGA-B88
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MEMORY CIRCUIT
  • Terminal Pitch
    0.8 mm
  • Mixed Memory Type
    FLASH+PSRAM
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    55 mA
  • Number of Terminals
    88
  • Standby Current-Max
    5.0E-6 Amp
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA88,8X12,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel

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RD38F2020W0YBQ0
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RD38F2020W0YBQ0