RC28F256P33T85
Micron Technology
- Lifecycle statusDiscontinued
- DescriptionFlash, 16MX16, 85ns, PBGA64
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.51
- SB Code8542.32.00.50
- TypeNOR TYPE
- Width8 mm
- Length10 mm
- Page Size4 words
- Boot BlockTOP
- TechnologyCMOS
- Toggle BitNO
- Sector Size16K,64K Words
- Data PollingNO
- JESD-30 CodeR-PBGA-B64
- Memory Width16
- Organization16MX16
- Package CodeTBGA
- JESD-609 Codee0
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, THIN PROFILE Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density268435456 bit
- Memory IC TypeFLASH
- Operating ModeASYNCHRONOUS
- Terminal Pitch1 mm
- Access Time-Max85 ns
- Number of Words16777216 words
- Parallel/SerialPARALLEL
- Terminal FinishTin/Lead (Sn/Pb)
- Seated Height-Max1.2 mm
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Additional FeatureSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT
- Supply Current-Max28 mA
- Number of Functions1
- Number of Terminals64
- Programming Voltage3 V
- Standby Current-Max0.000195 Amp
- Number of Words Code16M
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Command User InterfaceYES
- Common Flash InterfaceYES
- Number of Sectors/Size4,255
- Package Equivalence CodeBGA64,8X8,40
- Operating Temperature-Max85 Cel
- Operating Temperature-Min-40 Cel
- Supply Voltage-Max (Vsup)3.6 V
- Supply Voltage-Min (Vsup)2.3 V
- Supply Voltage-Nom (Vsup)3 V
- Peak Reflow Temperature (Cel)235
- Time@Peak Reflow Temperature-Max (s)30
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RC28F256P33T85