R1QGA7218ABG-25IB0
Renesas Electronics Corp.
- Lifecycle statusEOL
- RoHSRoHS compliant
- DescriptionQDRII/DDRII/ QDRII+/DDRII+ SRAM
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.41
- SB Code8542.32.00.40
- I/O TypeSEPARATE
- TechnologyCMOS
- JESD-30 CodeR-PBGA-B165
- Memory Width18
- Organization4MX18
- Package CodeBGA
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- Memory Density75497472 bit
- Memory IC TypeSTANDARD SRAM
- Operating ModeSYNCHRONOUS
- Terminal Pitch1 mm
- Access Time-Max0.55 ns
- Number of Words4194304 words
- Parallel/SerialPARALLEL
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Supply Current-Max980 mA
- Number of Terminals165
- Standby Current-Max0.72 Amp
- Standby Voltage-Min1.7 V
- Number of Words Code4M
- Qualification StatusNot Qualified
- Package Body MaterialPLASTIC/EPOXY
- Output Characteristics3-STATE
- Package Equivalence CodeBGA165,11X15,40
- Operating Temperature-Max85 Cel
- Operating Temperature-Min-40 Cel
- Clock Frequency-Max (fCLK)400 MHz
- Width15
- Length17
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R1QGA7218ABG-25IB0