QS-2-3-14-CJ-D-.1 by WPI GARRY ELECTRONICS | Sourcengine

WPI GARRY ELECTRONICS QS-2-3-14-CJ-D-.1

Lifecycle status
Transferred
Description
IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
Category
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
Mounting Style
STRAIGHT
Contact Material
BE-CU
Housing Material
GLASS FILLED EPOXY
Termination Type
SOLDER
Additional Feature
DECOUPLING CAP .1UF
Body Length (inch)
0.7
Current Rating (A)
3
Device Socket Type
IC SOCKET
Number of Contacts
14
Body Breadth (inch)
0.4
Device Type Used On
DIP14
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
AU
Socket Body Depth (inch)
0.062
Insulation Resistance (ohm)
2000000000
Mating Contact Pitch (inch)
0.1
Contact Finish - Termination
GOLD
PCB Contact Row Spacing (mm)
7.62
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Dielectric Withstanding Voltage (V)
1000VAC