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PN25F64BBGIAG

XTX TECHNOLOGY LTD

XTX TECHNOLOGY LTD PN25F64BBGIAG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B24
  • Memory Width
    8
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Write Protection
    HARDWARE
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Data Retention Time-Min
    20
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Endurance (Write/Erase Cycles)
    100000
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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PN25F64BBGIAG