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PF38F5060M0Y1C0

Micron Technology

Micron Technology PF38F5060M0Y1C0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    R-PBGA-B107
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MEMORY CIRCUIT
  • DLA Qualification
    Not Qualified
  • Mixed Memory Type
    FLASH+PSRAM
  • Terminal Position
    BOTTOM
  • Number of Terminals
    107
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    96
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    1.8
  • Standby Current-Max (A)
    0.00016
  • Package Equivalence Code
    BGA107,9X12,32

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PF38F5060M0Y1C0
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PF38F5060M0Y1C0