ProductsManufacturers
Events
Send an RFQBOM Tool

PF38F3040L0YCQ0

Micron Technology

Micron Technology PF38F3040L0YCQ0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • JESD-30 Code
    R-PBGA-B88
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MEMORY CIRCUIT
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    85 ns
  • Mixed Memory Type
    FLASH+PSRAM
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    35 mA
  • Number of Terminals
    88
  • Standby Current-Max
    0.00011 Amp
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA88,8X12,32
  • Supply Voltage-Nom (Vsup)
    1.8 V

0 suppliers available to buy or to bid for PF38F3040L0YCQ0

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
PF38F3040L0YCQ0
Send an RFQ
PF38F3040L0YCQ0