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PF29F32G32PANC1

Intel Corporation

PF29F32G32PANC1 Datasheet
Intel Corporation PF29F32G32PANC1
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    12
  • Length (mm)
    18
  • JESD-30 Code
    R-PBGA-B122
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 5 V SUPPLY
  • Number of Terminals
    122
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.8
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    8
  • Host Interface Standard
    ATA
  • Drive Interface Standard
    IDE
  • Package Equivalence Code
    BGA(UNSPEC)
  • uPs/uCs/Peripheral ICs Type
    SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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PF29F32G32PANC1