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PA25DIE

APEX MICROTECHNOLOGY INC

APEX MICROTECHNOLOGY INC PA25DIE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    YES
  • Low-Offset
    NO
  • Technology
    BIPOLAR
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-XUUC-N12
  • Package Code
    DIE
  • Package Shape
    RECTANGULAR
  • Package Style
    UNCASED CHIP Meter
  • Slew Rate-Nom
    1 V/us
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Temperature Grade
    MILITARY
  • Terminal Position
    UPPER
  • Unity Gain BW-Nom
    600 kHz
  • Number of Functions
    2
  • Number of Terminals
    12
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Frequency Compensation
    YES
  • Package Equivalence Code
    DIE OR CHIP
  • Supply Voltage Limit-Max
    20 V
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Nom (Vsup)
    15 V
  • Common-mode Reject Ratio-Nom
    85 dB
  • Neg Supply Voltage Limit-Max
    -20 V
  • Neg Supply Voltage-Nom (Vsup)
    -15 V

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