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NSC830D-3/A+

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP NSC830D-3/A+
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T40
  • Memory Width
    8
  • Organization
    2KX8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    16384 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    400 ns
  • Number of Words
    2048 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    10 mA
  • Number of Terminals
    40
  • Number of Words Code
    2K
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP40,.6
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

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NSC830D-3/A+
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NSC830D-3/A+