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NLV27WZ16DFT2G

ON SEMICONDUCTOR

NLV27WZ16DFT2G Datasheet
ON SEMICONDUCTOR NLV27WZ16DFT2G
  • Width
    1.25 mm
  • Family
    LVC/LCX/Z
  • Length
    2 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G6
  • Package Code
    TSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Packing Method
    TR
  • Terminal Pitch
    0.65 mm
  • Schmitt Trigger
    NO
  • Screening Level
    AEC-Q100
  • Number of Inputs
    1
  • Seated Height-Max
    1.1 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    6
  • Prop. Delay@Nom-Sup
    10.2 ns
  • Load Capacitance (CL)
    50 pF
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (tpd)
    10.2 ns
  • Package Equivalence Code
    TSSOP6,.08
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    1.65 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Power Supply Current-Max (ICC)
    0.01 mA

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NLV27WZ16DFT2G