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MYX4DD3K256M64PBG2-13IT

MICROSS COMPONENTS

MICROSS COMPONENTS MYX4DD3K256M64PBG2-13IT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • Width (mm)
    19
  • Access Mode
    MULTI BANK PAGE BURST
  • Length (mm)
    21.5
  • JESD-30 Code
    R-PBGA-B375
  • Memory Width
    64
  • Package Code
    BGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR3L DRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; SEATED HT-CALCULATED
  • Memory Organization
    256MX64
  • Number of Functions
    1
  • Number of Terminals
    375
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    256M
  • Memory Density (bits)
    17179869184
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.96
  • Supply Voltage-Nom (V)
    1.35
  • Number of Words (words)
    268435456

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MYX4DD3K256M64PBG2-13IT