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MY300XS

Microsemi Corporation

Microsemi Corporation MY300XS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8541.10.00.80
  • SB Code
    8541.10.00.80
  • Diode Type
    BRIDGE RECTIFIER DIODE
  • JESD-30 Code
    O-MUPM-D1
  • Configuration
    BRIDGE, 4 ELEMENTS
  • Package Shape
    ROUND
  • Package Style
    POST/STUD MOUNT Meter
  • Surface Mount
    NO
  • Terminal Form
    SOLDER LUG
  • J-STD-609 Code
    e0
  • Case Connection
    ISOLATED
  • Terminal Finish
    TIN LEAD
  • Number of Phases
    1
  • DLA Qualification
    Not Qualified
  • Terminal Position
    UPPER
  • Number of Elements
    4
  • Number of Terminals
    1
  • Package Body Material
    METAL
  • Diode Element Material
    SILICON
  • Output Current-Max (A)
    25
  • Rep Pk Reverse Voltage-Max (V)
    300
  • Non-rep Pk Forward Current-Max (A)
    150

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MY300XS
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MY300XS