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MX52LM01A11XUI

Macronix International Co., Ltd.

Macronix International Co., Ltd. MX52LM01A11XUI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Width
    10 mm
  • Length
    11 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    8
  • Organization
    1GX8
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8589934592 bit
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Words
    1073741824 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    0.8 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    MEMORY CAN ALSO ORGANIZED AS 8G X 1
  • Number of Functions
    1
  • Number of Terminals
    153
  • Number of Words Code
    1G
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    4
  • Package Equivalence Code
    BGA153,14X14,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    200 MHz

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MX52LM01A11XUI