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MX23L6414XI-90

Macronix International Co., Ltd.

Macronix International Co., Ltd. MX23L6414XI-90
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    10 mm
  • Length
    13 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B64
  • Memory Width
    16
  • Organization
    4MX16
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Access Time-Max
    90 ns
  • Number of Words
    4194304 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    CAN ALSO BE CONFIGURED AS 8M X 8
  • Number of Functions
    1
  • Number of Terminals
    64
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V

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MX23L6414XI-90
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MX23L6414XI-90