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MX23L3223MC-11

Macronix International Co., Ltd.

Macronix International Co., Ltd. MX23L3223MC-11
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G70
  • Memory Width
    32
  • Organization
    1MX32
  • Package Code
    SSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    33554432 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    110 ns
  • Number of Words
    1048576 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    60 mA
  • Number of Terminals
    70
  • Standby Current-Max
    5.0E-5 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Package Equivalence Code
    SOP70,.63,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    3.6 V

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MX23L3223MC-11
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MX23L3223MC-11