MX23L12824XI-12G by Macronix International Co., Ltd. | Sourcengine

Macronix International Co., Ltd. MX23L12824XI-12G

Lifecycle status
Discontinued
RoHS
RoHS compliant
Description
MASK ROM, 8MX16, 120ns, CMOS, PBGA64
Category
Semiconductors Memory ICs MASK ROMs MASK ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Width
10 mm
Length
13 mm
Technology
CMOS
JESD-30 Code
R-PBGA-B64
Memory Width
16
Organization
8MX16
Package Code
LBGA
JESD-609 Code
e1
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
134217728 bit
Memory IC Type
MASK ROM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
1 mm
Access Time-Max
120 ns
Number of Words
8388608 words
Parallel/Serial
PARALLEL
Seated Height-Max
1.4 mm
Temperature Grade
OTHER
Terminal Position
BOTTOM
Supply Current-Max
50 mA
Number of Functions
1
Number of Terminals
64
Standby Current-Max
1.5E-5 Amp
Number of Words Code
8M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
8
Package Equivalence Code
BGA64,8X8,40
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-25 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED