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MX23L12824XI-12

Macronix International Co., Ltd.

Macronix International Co., Ltd. MX23L12824XI-12
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B64
  • Memory Width
    16
  • Organization
    8MX16
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    134217728 bit
  • Memory IC Type
    MASK ROM
  • Terminal Pitch
    1 mm
  • Access Time-Max
    120 ns
  • Number of Words
    8388608 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    50 mA
  • Number of Terminals
    64
  • Standby Current-Max
    1.5E-5 Amp
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Package Equivalence Code
    BGA64,8X8,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel

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MX23L12824XI-12
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MX23L12824XI-12