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MTFDDAK800MBP-2AN16ABYY

Micron Technology

Micron Technology MTFDDAK800MBP-2AN16ABYY
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Width
    69.85 mm
  • Length
    100.45 mm
  • Technology
    CMOS
  • Data Polling
    NO
  • JESD-30 Code
    R-XXFM-X22
  • Memory Width
    8
  • Organization
    800GX8
  • Package Code
    XFM
  • Package Shape
    RECTANGULAR
  • Package Style
    FLANGE MOUNT Meter
  • Surface Mount
    NO
  • Terminal Form
    UNSPECIFIED
  • Memory Density
    6871947673600 bit
  • Memory IC Type
    FLASH MODULE
  • Number of Words
    858993459200 words
  • Seated Height-Max
    7 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    UNSPECIFIED
  • Number of Functions
    1
  • Number of Terminals
    22
  • Programming Voltage
    5 V
  • Number of Words Code
    800G
  • Package Body Material
    UNSPECIFIED
  • Command User Interface
    NO
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V

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MTFDDAK800MBP-2AN16ABYY