Micron Technology MTFC16GAPALNA-AITTR
  • Lifecycle status
    Active
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    Managed NAND Flash Serial e-MMC 3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit Automotive AEC-Q100 100-Pin TBGA Tray
  • Category
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NAND TYPE
  • Width
    14
  • Length
    18
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B100
  • Memory Width
    8
  • Organization
    16GX8
  • Package Code
    TBGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    137438953472
  • Memory IC Type
    Embedded MMC
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1
  • Number of Words
    17179869184
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1.2
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    140
  • Number of Functions
    1
  • Number of Terminals
    100
  • Programming Voltage
    2.7
  • Standby Current-Max
    .00011
  • Number of Words Code
    16G
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA100,10X15,40
  • Operating Temperature-Max
    85
  • Operating Temperature-Min
    -40
  • Supply Voltage-Max (Vsup)
    3.6
  • Supply Voltage-Min (Vsup)
    2.7
  • Clock Frequency-Max (fCLK)
    200
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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