MTA9ASF1G72HBZ-3G2XX by Micron Technology | Sourcengine

Micron Technology MTA9ASF1G72HBZ-3G2XX

Lifecycle status
Active
REACH
REACH compliant
Description
DDR4 DRAM Module, 1GX72, CMOS
Category
Semiconductors Memory ICs DRAMs DDR4 DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
3.7
Access Mode
SINGLE BANK PAGE BURST
Length (mm)
69.6
JESD-30 Code
R-XZMA-N260
Memory Width
72
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DDR4 DRAM MODULE
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
ZIG-ZAG
Additional Feature
AUTO/SELF REFRESH; WD-MAX
Memory Organization
1GX72
Number of Functions
1
Number of Terminals
260
Number of Words Code
1G
Memory Density (bits)
77309411328
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
30.15
Supply Voltage-Nom (V)
1.2
Number of Words (words)
1073741824
Clock Frequency-Max (MHz)
1600
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-40