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MT8870AC

ZARLINK SEMICONDUCTOR INC

ZARLINK SEMICONDUCTOR INC MT8870AC
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T18
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Telecom IC Type
    DTMF SIGNALING CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    9
  • Package Equivalence Code
    DIP18,.3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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MT8870AC
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MT8870AC