MT75W8Y136HBB-66 by Micron Technology | Sourcengine

Micron Technology MT75W8Y136HBB-66

Lifecycle status
Discontinued
Description
Content Addressable SRAM, 4KX272, CMOS, PBGA272
Category
Semiconductors Memory ICs SRAMs CONTENT ADDRESSABLE SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
Width (mm)
27
Length (mm)
27
JESD-30 Code
S-PBGA-B272
Memory Width
272
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
CONTENT ADDRESSABLE SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
PIPIELINED ARCHITECTURE; ALSO CONFIGURABLE AS 16K X 68
Memory Organization
4KX272
Number of Functions
1
Number of Terminals
272
Terminal Pitch (mm)
1.27
Number of Words Code
4K
Memory Density (bits)
1114112
Package Body Material
PLASTIC/EPOXY
Alternate Memory Width
136
Seated Height-Max (mm)
2.46
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
4096
Package Equivalence Code
BGA272,20X20,50
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0